Molex, the world's leading supplier of complete interconnect products announced with complete electrical, mechanical and optical connectivity, the new LED array lampholder base technology, technology which is the industry's first integrated interconnect systems and plastic substrates. This Bridgelux company to jointly develop a new technology has been integrated into the Vero * array of products Bridgelux recently released.
Molex's new technical connectivity and ease of use from the base of the LED array into a separate plastic base, so as to enhance the thermal, optical and mechanical interconnection function. This plastic substrate can be used a variety of ways, and the LED array package combination, the top surface of the LED array to provide a variety of connectivity options.
These improvements include insulation lug Molex Pico-EZmate ™ connectors, as well as improved mechanical adhesion and optical reference characteristics, while maintaining very low side. Compared with the need for welding in aluminum or ceramic material existing on the LED array package lug design of the new products can simplify the direct welding procedures and improve robustness. The the Pico-EZmate connection connector options solderless electrical interface, and help on-site maintenance and replacement.
LED array products can be expected, a new interconnect technology makes it easier to integrate and more cost-effective lighting allows OEM manufacturers to reduce the cost of LED lighting design system, speed up the time to market, and improve reliability.
The Bridgelux Sales and marketing director Jim Miller said the new interconnect technology is a significant improvement of the LED light source package to simplify a variety of real-time system integration issues, will help to open the era of intelligent lighting system. In the field of solid-state lighting technology integration will soon appear, as the situation in the field of consumer electronics products. Fusion need to integrate more functionality, sensors, communications, and other features to the LED lighting engine, this high-end platform technology through the use of a new product architecture is well suited to achieve fusion.
Molex's new technical connectivity and ease of use from the base of the LED array into a separate plastic base, so as to enhance the thermal, optical and mechanical interconnection function. This plastic substrate can be used a variety of ways, and the LED array package combination, the top surface of the LED array to provide a variety of connectivity options.
These improvements include insulation lug Molex Pico-EZmate ™ connectors, as well as improved mechanical adhesion and optical reference characteristics, while maintaining very low side. Compared with the need for welding in aluminum or ceramic material existing on the LED array package lug design of the new products can simplify the direct welding procedures and improve robustness. The the Pico-EZmate connection connector options solderless electrical interface, and help on-site maintenance and replacement.
LED array products can be expected, a new interconnect technology makes it easier to integrate and more cost-effective lighting allows OEM manufacturers to reduce the cost of LED lighting design system, speed up the time to market, and improve reliability.
The Bridgelux Sales and marketing director Jim Miller said the new interconnect technology is a significant improvement of the LED light source package to simplify a variety of real-time system integration issues, will help to open the era of intelligent lighting system. In the field of solid-state lighting technology integration will soon appear, as the situation in the field of consumer electronics products. Fusion need to integrate more functionality, sensors, communications, and other features to the LED lighting engine, this high-end platform technology through the use of a new product architecture is well suited to achieve fusion.
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